{"@context":"https://schema.org","@type":"JobPosting","title":"Senior NPI Product Engineer","description":"

Our Team\n\n

Semtech's New Product Introduction (NPI) Product Engineering Team is the central engineering function behind every new product we bring to market. Our team of focused and talented engineers takes full ownership of new product development — driving each program from conception through end-of-life with a commitment to flawless execution. Working closely with all internal cross-functional teams, our engineers define and drive DfT testability requirements, test coverage, production characterization (across process, voltage, and temperature variations), ATE-to-bench correlation, cost and yield optimization, test time reduction, project logistics, and seamless transfer to full-volume manufacturing. We take pride in delivering high-quality products that exceed customer expectations and drive business success — and our versatile, results-driven team makes it happen.

Job Summary\n\n

We are currently looking for a

Sr. NPI Product Engineer

to join our team. This role sits at the heart of new product development — engaged from product concept through end-of-life — collaborating closely with all internal cross-functional teams to drive program success. This is a unique opportunity for a passionate and driven engineer to influence key engineering and product decisions and make a meaningful impact on the cutting-edge products we deliver to our customers worldwide.

This is an exciting opportunity to work within a world-class NPI development team, focused on designing and developing advanced high-performance analog and mixed-signal semiconductor IC products in cutting-edge CMOS and BiCMOS technologies. Our products are built with purpose and precision — operating at data rates of 25–400Gbps and beyond — delivering faster, more reliable connectivity for AI data centers, PON, and 5G wireless networks. Reporting to the Manager of NPI Product Engineering, the Sr. NPI Product Engineer will take full ownership of all NPI activities — driving and executing from product concept through final product release while maintaining the product life cycle.

Responsibilities\n\n\n

NPI Program Leadership & Cross-Functional Collaboration (25%)Lead and drive all NPI activities from product concept through final product release while ensuring product conformance to specifications, and seamless transfer to full-volume manufacturingCollaborate with internal cross-functional teams including Project Lead, Design, Marketing, Validation, Test Engineering, Characterization, Quality & Reliability, Applications Engineering and Operations to ensure successful product development and deliveryActively participate in the milestone reviews of NPI program logistics, timelines, and milestones, providing regular updates to management and stakeholdersPrepare all NPI product release and OSAT related manufacturing documentations for production transfer and product maintenanceMentor and provide technical guidance to junior product engineers Design for Testability/Manufacturability (35%)Lead team to define Design for Manufacturability (DfM) and Design for Testability (DfT) requirements for NPI products and provide feedback to design for implementation to ensure comprehensive and efficient production test coverageSupport test engineers in the development, implementation, verification and optimization of ATE test programs ensuring the testability/manufacturability features are considered and implemented, and that test coverage and quality is achieved while maintaining accurate cost modelsLead product characterization, correlation and release activities, ensuring all datasheet specifications are validated and met Characterization, Data Analysis & Yield Optimization (30%)Develop comprehensive product characterization plans encompassing both wafer-level and bench characterization tests, ensuring thorough test coverage across all product specifications and operating conditionsConduct rigorous data analysis of ATE and bench characterization results across process, voltage, and temperature (PVT) variations, including ATE-to-bench correlation studies, PCM data analysis, process capability analysis to ensure product conformance to specifications and yield modeling for new productsPlan and execute Design of Experiments (DOE) to optimize product performance, drive yield analysis, test time reduction, and test optimization efforts — identifying and resolving yield limiters in close collaboration with Design, Test, Quality, and Foundry Process teamsContribute to product validation and reliability qualification plans working closely with Test, Characterization, Validation, and Reliability Engineering teams to ensure alignment and successful execution Manufacturing Quality, Failure Analysis & Continuous Improvement (10%)Work with foundry process/packaging engineering in the resolution of problems that occur during wafer fabrication, packaging, die sort and final package test processesDrive the resolution of failure analysis, root cause and corrective actions for field returnsMonitor and maintain product life cycle, identifying opportunities for cost reduction and continuous improvement\n\n

NPI Program Leadership & Cross-Functional Collaboration (25%)

Lead and drive all NPI activities from product concept through final product release while ensuring product conformance to specifications, and seamless transfer to full-volume manufacturing

Collaborate with internal cross-functional teams including Project Lead, Design, Marketing, Validation, Test Engineering, Characterization, Quality & Reliability, Applications Engineering and Operations to ensure successful product development and delivery

Actively participate in the milestone reviews of NPI program logistics, timelines, and milestones, providing regular updates to management and stakeholders

Prepare all NPI product release and OSAT related manufacturing documentations for production transfer and product maintenance

Mentor and provide technical guidance to junior product engineers

Design for Testability/Manufacturability (35%)

Lead team to define Design for Manufacturability (DfM) and Design for Testability (DfT) requirements for NPI products and provide feedback to design for implementation to ensure comprehensive and efficient production test coverage

Support test engineers in the development, implementation, verification and optimization of ATE test programs ensuring the testability/manufacturability features are considered and implemented, and that test coverage and quality is achieved while maintaining accurate cost models

Lead product characterization, correlation and release activities, ensuring all datasheet specifications are validated and met

Characterization, Data Analysis & Yield Optimization (30%)

Develop comprehensive product characterization plans encompassing both wafer-level and bench characterization tests, ensuring thorough test coverage across all product specifications and operating conditions

Conduct rigorous data analysis of ATE and bench characterization results across process, voltage, and temperature (PVT) variations, including ATE-to-bench correlation studies, PCM data analysis, process capability analysis to ensure product conformance to specifications and yield modeling for new products

Plan and execute Design of Experiments (DOE) to optimize product performance, drive yield analysis, test time reduction, and test optimization efforts — identifying and resolving yield limiters in close collaboration with Design, Test, Quality, and Foundry Process teams

Contribute to product validation and reliability qualification plans working closely with Test, Characterization, Validation, and Reliability Engineering teams to ensure alignment and successful execution

Manufacturing Quality, Failure Analysis & Continuous Improvement (10%)

Work with foundry process/packaging engineering in the resolution of problems that occur during wafer fabrication, packaging, die sort and final package test processes

Drive the resolution of failure analysis, root cause and corrective actions for field returns

Monitor and maintain product life cycle, identifying opportunities for cost reduction and continuous improvement\n\n

Minimum Qualifications\n\n\n

BSc in Electrical Engineering or related field and a minimum of 8 years relevant work experience.Experience in semi-conductor technology, product, test and/or design engineering.Experience with quality systems including corrective actions, 8D reports, non-conformance reports, and failure analysis reports.Knowledge and experience with statistical theory and data analysis tools (e.g. Excel, JMP, Galaxy, dataConductor) for design of experiments, yield reporting and modelling.Experience in high-speed digital ATE test platforms (e.g. Advantest, Teradyne) or equivalent rack solutions is an asset.Strong knowledge of high-speed serial digital interconnect components and test methodologiesExperience with JEDEC, and/or Mil quality requirements.\n\n

BSc in Electrical Engineering or related field and a minimum of 8 years relevant work experience.

Experience in semi-conductor technology, product, test and/or design engineering.

Experience with quality systems including corrective actions, 8D reports, non-conformance reports, and failure analysis reports.

Knowledge and experience with statistical theory and data analysis tools (e.g. Excel, JMP, Galaxy, dataConductor) for design of experiments, yield reporting and modelling.

Experience in high-speed digital ATE test platforms (e.g. Advantest, Teradyne) or equivalent rack solutions is an asset.

Strong knowledge of high-speed serial digital interconnect components and test methodologies

Experience with JEDEC, and/or Mil quality requirements.\n\n

This job description intends to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.\n\n

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

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